Heat-resistant adhesive - Company Ranking(7 companies in total)
Last Updated： Aggregation Period:Dec 03, 2025〜Dec 30, 2025
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| ■Main Features - Heat resistance up to 1650°C - One-component ceramic adhesive filled with inorganic binder and alumina - Water-based and d... | ■Main Uses It is widely used for applications ranging from the bonding of ceramic gaskets to electrical insulation sensors, high-power res... | ||
| - Crystal Bond 509: Thermoplastic temporary adhesive. Flow point is 74°C. - Crystal Bond 555: Low melting point thermoplastic temporary adhe... | - Metal piece processing inspected with an electron microscope - Dicing processing of semiconductors - Dicing processing of ceramics and qua... | ||
| Heat-resistant adhesive / Heat-resistant epoxy adhesive (organic) ■ For high temperature range from -65℃ to 300℃ - Alembond 526N - Ale... | ● Adhesion of ceramic electronic components (through-nozzle) ● Adhesion of aluminum or copper parts and heat sinks for electrical, electro... | ||
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オーデック
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- Featured Products
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Heat-resistant adhesive | Ceramic adhesive (inorganic) Ceramabond 552
- overview
- ■Main Features - Heat resistance up to 1650°C - One-component ceramic adhesive filled with inorganic binder and alumina - Water-based and d...
- Application/Performance example
- ■Main Uses It is widely used for applications ranging from the bonding of ceramic gaskets to electrical insulation sensors, high-power res...
Heat-resistant adhesive | Temporary adhesive "Crystal Bond" series
- overview
- - Crystal Bond 509: Thermoplastic temporary adhesive. Flow point is 74°C. - Crystal Bond 555: Low melting point thermoplastic temporary adhe...
- Application/Performance example
- - Metal piece processing inspected with an electron microscope - Dicing processing of semiconductors - Dicing processing of ceramics and qua...
Heat-resistant adhesive | Epoxy adhesive (organic) "Alemco Bond" series
- overview
- Heat-resistant adhesive / Heat-resistant epoxy adhesive (organic) ■ For high temperature range from -65℃ to 300℃ - Alembond 526N - Ale...
- Application/Performance example
- ● Adhesion of ceramic electronic components (through-nozzle) ● Adhesion of aluminum or copper parts and heat sinks for electrical, electro...
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オーデック
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